老女人下面毛荫荫的黑森林

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  • Technology

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    NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

    Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

    P.O:315327

    Mail:sales@chipex.cn

    Tel:(86)-574-63078606;

              (86)-574-63078608-8858


    0201技術

    Current Location: Home >> Technology >> 0201

          Making TVS devices by using Wafer-Level Packaging technology can obviously reduce device size and significantly improve electrical performance and reliability, shorten the package time and lower cost, which was widely used in mobile phones, MP3 players, PDAs and digital cameras and other portable electronic products to provide protection and improve its reliability.




    ltem

    Standard

    Other

    Die Size Without Dicing Street

    570x270um

    NA

    Dicing Street

    60um

    No metal allowed in the dicing street

    Bump pitch

    400um within

    Follow customer requirement

    Bump Size

    120X210um

    Follow customer requirement

    Bump Height

    11um(Cu 8um+Sn 3um)

    Only Bake and no feflow allowed

    BG Thickness

    265um

    Follow customer requirement




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    老女人下面毛荫荫的黑森林