老女人下面毛荫荫的黑森林

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  • Technology

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    NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

    Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

    P.O:315327

    Mail:sales@chipex.cn

    Tel:(86)-574-63078606;

              (86)-574-63078608-8858


    Plating Solder

    Current Location: Home >> Technology >> Plating Solder

           Electroplating solder Technology is making tin bumps on the chip pads by series processes such as coating, litho, electroplating and etching, and then using high temperature melting the bumps and been packaged, the IC size can significantly be reduced by this technology, and has a high density, low induction, low cost, good heat dissipation and so on. Wafer-level chip scale packaging is generally applicable to large-size solder balls placed on large pads and the solder technology applied in the manufacture of fine pitch and ultra-thin package of the small tin ball way. This technology successfully applied to flip and reflected its superiority.


    Solder Bump StructurePl ThicknessUBM ThicknessOther

    1M

    (UBM+Solder Bump)

    NA8um Cu+Sn

    Min.Bumo Pitch:0.15mm

    Min.Ball Size:0.08mm

    Min.Ball Height:0.020mm

    Min.PI Opening:30um

    Min.Trace Line X Space:10X10UM


    1P1M

    (PI+UBM+Solder BUMP)

    5um8um Cu+Sn

    2P2M

    (1st PI+RDL+2ndPI+

      UBM+Solder Bump)


    1st PI 5um

    2nd PI 10um

    RDL:5um Cu UBM:8um Cu+Sn

    APPlication:

    Smart Card,VCM Driver,Switch,Audio& Video,EEPROM/Flash/SRAM,MEMS&Sensor,ucontrollers


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    a. Standard Turnkey process: Min. BG thickness 200um, T/R shipment;


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    b. Special process: Min. BG thickness 60um, Wafer ring shipment.


    老女人下面毛荫荫的黑森林