老女人下面毛荫荫的黑森林

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    NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

    Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

    P.O:315327

    Mail:sales@chipex.cn

    Tel:(86)-574-63078606;

              (86)-574-63078608-8858


    CuPillar

    Current Location: Home >> Technology >> CuPillar

        Copper pillar process is making copper-tin bumps on the surface of the chip for "point-of-connection" between the chips or the chips and the substrates by utilizing gluing, litho, electroplating and etching process and other production technology through the surface of the chip in the production of copper and tin bumps after wafer processing of the substrate circuit. The array of bumps on the die surface allows pin density to be higher due to the elimination of the traditional "wire bonding" to the surrounding metal, reducing the area of the chip to meet the performance requirements of the chip, low resistance, low parasitic capacitance, low inductance, low power consumption, low signal-to-noise ratio, low cost, and so on.



    Cu-Pillar StructurePI ThicknessStandard Cu-PillarMicro Cu-Pillar

    1M

    (Dirctl Cu-Pillar)

    NA

    Pitch:150um

    Bump Size:80-100um

    Bunp Height:

    65um Cu+35um Sn

    Min.Pitch:90um

    Min.Bump Size:45um

    Bum Hemp:

    25um Cu+20um Sn

    1P1M

    (PI+Cu-Pillar)

    5um

    1P2M

    (PI+RDL+Cu-Pillar)

    5um

    2P2M

    1st PI+RDL+2ndPI+Cu-Pillar

    1st PI5um

    2ndPI 10um 



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    Application:

    PMU.Smart.Card.RF.PA.MEMS&Sensor.ucontrollers.EEPROM/Dram/Flash/SRAM


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    老女人下面毛荫荫的黑森林