老女人下面毛荫荫的黑森林

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    NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

    Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

    P.O:315327

    Mail:sales@chipex.cn

    Tel:(86)-574-63078606;

              (86)-574-63078608-8858


    Service

    Current Location: Home >> Service >> Product

          Providing wafer-level packaging services including wafer-level chip-scale packaging, plating solder, copper bump process, RDL and so on.

          Providing variety of flip-chip packaging and packaging line including QFN, DFN, SOT, SOP, LGA and BGA, etc to the traditional packaging factories cooperated.



    A. Wafer Level Package


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    PackageSolder BumpPillar BumpWLCSPRDL
    Wafer Size6and 8 inch
    UBMTi/Cu
    MaterialSolderCu/Sn,Cu/SnAGLeadfreeAl,Cu,Ni/Pd/Au,Ni/Au
    Min.Pitch
    150um90um300umL/S:10/10um
    RepassivationPl,SMF,LowTem.Pl,PBO


    B. Flip Chip Package


    Package Type:LGA/BGA,QFN,DFN,SOT,SOP can be provided by ChipEx and assembly packing partners.




    C. Product Features




    老女人下面毛荫荫的黑森林