Providing wafer-level packaging services including wafer-level chip-scale packaging, plating solder, copper bump process, RDL and so on.
Providing variety of flip-chip packaging and packaging line including QFN, DFN, SOT, SOP, LGA and BGA, etc to the traditional packaging factories cooperated.
A. Wafer Level Package
|Package||Solder Bump||Pillar Bump||WLCSP||RDL|
|Wafer Size||6and 8 inch|
B. Flip Chip Package
Package Type:LGA/BGA,QFN,DFN,SOT,SOP can be provided by ChipEx and assembly packing partners.
C. Product Features